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For TAB tapes and flex circuitry, laminates with adhesives (3‐layer laminates) are commonly used. The drawbacks of adhesives are well known. Adhesiveless flexible copper‐polyimide laminates (2‐layer laminates) could avoid such disadvantages. Two‐layer thin film laminates may be produced using sputtering technology. Good adhesion strength between the copper and the polyimide film may be achieved by means of special plasma treatment. The advantages and disadvantages of 2‐layer flexible thin film laminates are discussed in this paper, along with their different production methods. The adhesion strength of 2‐layer laminates in comparison with 3‐layer laminates will be pointed out. Future uses of 2‐layer flexible thin film laminates will be considered, along with their benefits.

‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by SMT‐Info, together with the ISHM‐Czech and Slovak Chapter. The purpose of this common action was to bring together the professionals in surface mount technology and thick film technology. In the framework of the conference, in which 130 home and foreign delegates participated, the annual meeting of the ISHM‐Czech and Slovak Chapter took place.

In this paper, we consider intrinsic properties of copper electrodeposited as plateup on polyimide substrate, thermal response of electrodeposited copper and fatigue performance of copper and copper/polyimide construction. The critical material characteristics examined are grain morphology and structure, crystallographic texture, microhardness, uniaxial strength and ductility and isothermal cyclic fatigue life. Given optimum processing conditions, copper plateup in flexible circuits displays fine grain structure, high ductility, adequate thermal stability, freedom from thermal embrittlement and excellent fatigue endurance over a wide range of strain amplitudes.

Coors Ceramics GmbH, subsidiary of Coors Ceramics Company's Electronic Products Group, has appointed Mr Viktor Fronz as its German National Accounts Manager. Mr Fronz assumed responsibility for all of Coors Ceramics' electronic products accounts in Germany on 1 July 1994.

The purpose of this study is that the effects of surface mount technology (SMT) assembly process on the product lifetime of fine-pitch printed circuit boards (PCBs) were investigated under biased highly accelerated stress testing (HAST).

SMT assembly from a semiconductor SMT assembly process was replicated to test PCBs under the same conditions as SMT-assembled PCBs. The median lives µ and standard deviation s of the test PCBs were calculated from the log-normal distribution. The failure analysis of current leakages was conducted by the focused ion beam, scanning electron microscopy and energy-dispersive X-ray spectroscopy. Using the inverse power law and modified Peck-H’s relationship, the PCB lives at accelerated (by SMT assembly stress) and user conditions were calculated.

The failure analysis demonstrated that SiO₂ and BaSO₄ fillers added for stiffening organic materials promote current leakage failure. Therefore, the hydrophobicity of these fillers is believed to be necessary to suppress the current leakage failure under biased HAST. The inverse power law model indicates that the acceleration life model with SMT assembly stress can be given as follows: L(V) = 271.9(S)^−0.5031. From modified Peck-H’s relationship, after the third SMT assembly, the time required to attain 0.96 per cent failures at 35°C/60 per cent RH/1.9 V and 130°C/85 per cent RH/3.5 V are 129 y and 69.5 h, respectively. The biased HAST at 130°C/85 per cent/3.5 V after the third SMT assembly for 69.5 h on 238 samples could be recommended as an early quality-monitoring procedure.

In the future, the failure modes in an early stage of a bathtub should be analyzed and the life prediction model should be studied accordingly.

Through this study, the lifetime prediction model and early quality-monitoring procedure for organic substrates because of SMT assembly stress were obtained.

Trust in disaster communication is significant because a lack of trust will prevent the transformation of information into usable knowledge for an effective disaster response. Therefore, the purpose of this paper is to investigate how the culture and network ties of an affected community can encourage trust and participation in disaster communication.

A qualitative case study of Jalin Merapi (JM) was conducted by interviewing 33 research participants in the Mt Merapi surroundings.

The findings indicate that culture-embedded disaster communication plays important roles in increasing the effectiveness of disaster information and encouraging trust in the authenticity of locally based disaster information at the individual level. The findings also identify that strong ties and weak ties play different roles in disaster communication. The strong ties are more effective in facilitating information diffusion and encourage trust and community participation within the affected community. Furthermore, the weak ties are more effective in disseminating information to wider audiences, and have an indirect influence in encouraging trust by extending the offline social network owned by the affected community.

Most literature on disaster communication focusses on the construction of disaster messages to encourage effective disaster response. Less attention has been paid to the information receivers regarding how disaster information is considered to be trustworthy by the affected community and how it can increase collective participation in community-based disaster communication.

Although the rapid spread of information processing technology is widely expected to have dramatic social impacts, the argument most commonly advanced for this position, a simple appeal to the speed of technical progress, is quite weak. Any more compelling case must identify the attributes of information technology which distinguish it from other, less disruptive, technical innovations. One such is informa‐tion technology's combination of high reactivity, coupled with a basic lack of understanding of its underlying conceptual structure on the part of those who have to adapt to it. This lack of understanding not only implies that users will become alienated from their environment, but also presents practical difficulties to applications of information technology such as office automation. This analysis makes the basic cognitive skills, such as procedural reasoning, underlying any effective use of information processing devices a topic of central concern. However, neither the difficulty nor the importance of these skills are widely appreciated. Most of the techniques which have been proposed to facilitate the use of complex, programmed devices are simply incommensurate in scope with the problem. A Gendanken analysis of programming is advanced to indicate why this is so and to serve as the basis for an agenda of cognitive science research.

This paper aims to apply the augmented reality (AR) technology to assembly design in the early design stage. A proof‐of‐concept system with AR interface is developed.

Through AR interface, designers can design the assembly on the real assembly platform. The system helps users to design the assembly features to provide proper part‐part constraints in the early design stage. The virtual assembly features are rendered on the real assembly platform using AR registration techniques. The new evaluated assembly parts can be generated in the AR interface and assembled to assembly platform through assembly features. The model‐based collision detection technique is implemented for assembly constraint evaluation.

With AR interface, it would be possible to combine some of the benefits of both physical and virtual prototyping (VP). The AR environment can save a lot of computation resource compared to a totally virtual environment. Working on real assembly platform, designers have more realistic feel and the ability to design an assembly in a more intuitive way.

More interaction tools need to be developed to support the complex assembly design efficiently.

The presented system encourages designers to consider the assembly issues in the early design stage. The primitive 3D models of assembly parts with proper part‐part constraints are generated using the system before doing detailed geometry design.

A new markerless registration approach for AR system is presented. This generic approach can be also used for other AR applications.